InGaAsP/InP undercut mesa laser with planar polyimide passivation

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

Ridge Semiconductor Laser with Laterally Undercut Etched Current Confinement Structure

In this paper we modeled and analyzed the ridge type InGaAlAs/InP semiconductor laser with lateral current confinement structure, and optimized the design for the ridge wave guide with the current confinement. We proposed and fabricated the ridge type InGaAlAs/InP laser with a cost effective selective undercut etching method and demonstrated the improvement of the ridge laser performance. This ...

Hugoniot measurements for polyimide with laser and explosives

Advanced Multilayer Polyimide Substrate Utilizing UV Laser Microvia Technology

This paper presents ongoing work on an advanced flexible circuit interconnect substrate featuring a 24 x 24 (576 element) pad grid array pattern at 300 micron pitch. This eight metal layer circuit is being developed as a highdensity, pixel-level interconnection substrate for a two-dimensional (2D) ultrasound imaging transducer MEMS device. The flexible circuit substrate is constructed using lam...

Finding Undercut-Free Parting Directions for Polygons with Curved Edges

We consider the problem of whether a given geometry can be molded in a two-part, rigid, reusable mold with opposite removal directions. We describe an efficient algorithm for solving the opposite direction moldability problem for a 2D “polygon” bounded by edges that may be either straight or curved. We introduce a structure, the normal graph of the polygon, that represents the range of normals ...